The integration of artificial intelligence into packaging allows for advanced processes such as virtual package testing to efficiently and economically validate designs before manufacturing begins. Utilizing the ANSYS™ software suite and our proprietary materials database, we can intelligently design packaging utilizing the power of predictive algorithms.

Specifically ANSYS LS-DYNA, which is a module within the platform, that simulates drops, impacts & penetrations, This is especially relevant when shaping and securing advanced electronic systems into packaging and our Taiwan design center is pioneering the use of ANSYS LS-DYNA to engineer smarter, sustainable solutions.